• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a method for engraving, marking and / or inscribing a workpiece (7) with a laser plotter (2) and a laser plotter (2), in which at least one beam source (4) is provided in a housing (3) of the laser plotter (2). in the form of a laser (5,6) to be machined workpiece (7) is used. The workpiece (7) is deposited on a processing table (9) and a laser beam (10) emitted by the beam source (4) is transmitted via deflecting elements (11) to at least one focusing unit (12) from which the laser beam (10) moves in the direction Workpiece (7) deflected and focused for processing. The control, in particular the position control of the laser beam (10) to the workpiece (7), via a running in a control unit (13) software, so that the workpiece (7) is edited line by line by adjusting a carriage. Preferably, a graphic (17) and / or a text (18) is created on an external component (14), in particular a computer or a control unit, which is transferred to the control unit (13) of the laser plotter (2), which converts the transferred data, in particular the graphic (17) and / or the text (18), for controlling the individual elements of the laser plotter (2) makes. After inserting the workpiece (7) in the processing area (8), a laser pointer (27) of the laser (5,6) is positioned on or in the region of the workpiece (7), after which activation of the machining process or a focusing process preferably a position correction is performed. Subsequently, a distance measurement (32) is performed on a surface (28) of the workpiece (7) and the determined data are transferred to the control unit (13), which then calculates a position of the processing table (9) for the optimum focal point of the laser (FIG. 5,6) taking into account predetermined parameters, in particular the used replaceable laser lens (32), and then the processing table (9) is adjusted.
    公开号:AT517185A1
    申请号:T50402/2015
    申请日:2015-05-13
    公开日:2016-11-15
    发明作者:
    申请人:Trodat Gmbh；
    IPC主号:
    专利说明:

    Method for engraving, marking and / or inscribing a workpiece (10) with a laser plotter and laser plotter therefor
    The invention relates to a method for engraving, marking and / or inscribing a workpiece with a laser plotter and a laser plotter, as described in claims 1 and 9.
    In laser plotters, the laser light is sharply focused with a focusing lens. The focus of the laser beam is an extremely high power density, with which materials can be melted or evaporated, engraved, marked or labeled. In order to produce this focus, various methods have hitherto been used in the laserplotter in the general state of the art:
    Manual focusing: The height-adjustable machining table of the laser plotter is raised or lowered by means of two buttons (Z-axis). The focus position is determined visually using a so-called "focus tool". Each lens focal length requires its own focus tool. Usually there are several lens focal lengths, namely 1.5; 2; 2.5; 2.85; 3.2; 4 and 5 inches, available. Disadvantage of such a manual adjustment is that this allows a very high inaccuracy in the operation, as the user manually adjusted in height and thus often does not stop in time the editing table. As a result, the quality of an engraving suffers greatly because the focused laser beam is not optimally matched to the surface of the workpiece.
    Automatic focusing via software: Here, a program is started in the computer, which supplies the laser plotter with data. However, it is necessary that the user must know the thickness of the workpiece and enter it correctly into the software so that the thickness of the material to be processed can be stored. Furthermore, the user must select the correct lens. When the automatic software focus function is selected in the computer, before each laser processing, the machining table (Z axis) is calculated to the position calculated from the material thickness, lens focal length and previous table (Z) and the position is corrected. There is a great disadvantage here, since the user must make incorrect entries or must know exactly which components are used and how thick the workpiece to be machined.
    Automatic focusing with light barrier: There is a light barrier in the processing area of the laser plotter, which is preferably at the Y-position about 40mm. The light barrier measures over the entire processing table. After inserting the workpiece to be machined, the user can start an automatic focusing on material thickness directly on the machine keyboard. This so-called "hardware autofocus" is triggered by preferably simultaneously pressing the Z-up and Z-down keys. The machine control recognizes whether the worktable needs to be raised or lowered to move the material surface to the level of the light barrier. Disadvantage here is that only at a certain point, preferably only at the position Y = 40mm are focused. Another disadvantage is that materials thinner than the side-mounted Y-ruler (stopper, 2mm) can not be focussed, which is the case for cutting paper, cloth, and the like. Also, the light barrier is only suitable for a lens focal length, so that with a changed lens, the user would have to make a correction via the machine control.
    The object of the invention is to provide a method and a laser plotter in which the simplest possible focusing on an inserted workpiece is possible. It should also be possible that the workpiece can be positioned at any position in the processing space of the laser plotter. Another object is to avoid the aforementioned disadvantages.
    The object of the invention is achieved by a method for engraving, marking and / or inscribing a workpiece (12) with a laser plotter in which a laser pointer of the laser is positioned on or in the region of the workpiece after insertion of the workpiece in the processing area whereupon after activation of the machining process or focusing process, preferably a position correction is performed and then a distance measurement is performed on the surface of the workpiece and the determined data is passed to the control unit, which then calculates a position of the machining table for the optimum focal point of the laser under consideration of predetermined parameters, in particular the used replaceable laser lens, performs and then the working table is adjusted.
    The advantage here is that thereby the workpiece can be placed on any position in the processing area, the user makes a rough position determination on the laser pointer and thus subsequently a simple distance measurement can be made on the inserted workpiece. It is also possible that uneven, cambered and stepped workpieces can be used, since the user can determine the focal point via the laser pointer. In the distance measurement used is achieved in an advantageous manner that so that the surface of the workpiece is detected, so that appropriate distances can be determined, and it is also possible that a corresponding surface profile is created, which is displayed to the user on the screen. In principle, it is also possible to adjust the focus, in particular the machining table, by knowing the surface course during the machining process, so that the optimum focusing is always given for different workpiece heights.
    An advantageous measure is that a constant distance measurement is performed during the adjustment of the machining table. As a result, the processing table can be optimally aligned to the surface of the workpiece. Of course, it is also possible that an adjustment of the machining table is performed without the distance measurement, since the position of the machining table has been previously determined.
    Another advantage is a measure in which after activating the machining operation, the focusing is adjusted by a definable correction factor, so that the distance measurement takes place at the position of the laser pointer. As a result, a simple construction of the focusing unit is achieved, since the mounting of the distance measuring device outside of the laser pointer and the laser optics can be done, but the measurement of the distance takes place exactly on the position of the laser pointer. The user thus does not need to make corrections, so that the user-friendliness is increased. It is also possible that when changing the focus unit with the distance-measuring device at different position of the distance-measuring device again only a new correction value must be set.
    An advantage is a measure in which the distance measurement is carried out via ultrasound. .This allows the surface of different materials to be reliably detected. At the same time a cost-effective use of already known ultrasonic distance measurements from other fields is possible because the attachment to the
    Focusing unit can be done arbitrarily. At the same time, it is not necessary for the user to be able to set the position exactly, because the ultrasound measurement covers a larger area and nevertheless the highest point of the workpiece can be determined.
    An advantageous measure is that during the distance measurement, the focusing unit of the laser plotter is adjusted in accordance with a presettable movement path. As a result, a larger area can be detected so that the positioning via the laser pointer does not have to be accurate. Another advantage is that it allows lower differences in height, which the user ev. Can not detect with the naked eye, can be determined in the alignment on the highest point of the workpiece this. If enough time is available, it is also possible that the user only starts a focusing process and then the entire processing area is detected with the ultrasonic sensor, so that no presetting of the position is necessary.
    An advantage is a measure in which, before the start of the machining process, the machining table and the focusing unit, in particular the laser pointer, are adjusted to confirm the position. As a result, the determined position is displayed to the user via the laser pointer, whereupon the latter can confirm or correct the position. It is also possible that after a certain period of time, for example of 5 sec, the processing operation is started without confirmation of the user. Of course, it is possible that this option of the determined position indicator in the software of the laser plotter can be deactivated.
    An advantageous measure is that due to the determined data, a position detection of the workpiece is performed. This allows the user to insert the workpiece as desired, which significantly increases the user-friendliness.
    It is advantageous to combine several parameters of the machining process with the data of the distance measurement to determine the focus.
    This allows optimal adaptation to a wide variety of components.
    Furthermore, the object of the invention is also achieved by a laser plotter, in which a distance measuring device is arranged in the region of the focusing unit, and this is connected to the control unit for transmission of the determined data, in particular the height or distance of the inserted workpiece.
    It is advantageous hereby that the adjustment of the focus of the laser does not take place on the processing table, but is aligned directly with the height of the workpiece. As a result, the laser quality can be significantly improved. Another significant advantage is that the system used, in particular an ultrasonic distance measurement, the positioning does not have to be accurate, since the distance measuring system covers a larger area, whereby the user-friendliness is improved.
    An advantage is an embodiment in which the distance measuring device is formed by an ultrasonic sensor. This ensures that already low-cost system can be used from the prior art, which are mounted in the focusing unit.
    An embodiment is advantageous in which a position correction value for the distance measuring device is stored in the laser plotter, in particular in a control unit. As a result, any distance measuring device of the most varied size can be used, since the focusing unit and thus the distance measuring device are moved accordingly for the distance measurement.
    Finally, an embodiment is advantageous in which a plurality of distance measuring devices, in particular ultrasonic sensors, are positioned on the focusing unit. As a result, the quality of the distance measurement can be increased since the corresponding distance measuring unit can be selected for different materials.
    The invention will now be described in the form of embodiments, it being understood that the invention is not limited to the illustrated and described embodiments or solutions.
    Show it:
    A schematic representation of a device with a laser plotter and associated display element;
    Fig. 2 is a perspective view of the focusing with the distance measuring device arranged thereon, in a simplified, schematic representation.
    By way of introduction, it should be noted that in the various embodiments, the same parts are provided with the same reference numerals or the same component names, wherein the disclosures contained in the entire description can be mutatis mutandis to the same parts with the same reference numerals and component names. Also, the location information chosen in the description, such as top, bottom, side, etc. related to the described figure and are mutatis mutandis transferred to the new situation in a change in position. Also, individual features or combinations of features from the illustrated and described embodiments may represent separate inventive solutions.
    In Fig. 1, a processing device 1, in particular a laser plotter 2, or also called laser engraver, shown schematically, in which in a housing 3 at least one, in particular two radiation sources 4 in the form of lasers 5, 6 are arranged and operated. The lasers 5 and 6 preferably act alternately on the workpiece 7 to be machined, wherein the workpiece 7 is positioned in a processing area 8 of the laser plotter 2, in particular on a processing table 9. A laser beam 10 emitted by the radiation source 4 is transmitted via deflecting elements 11 to at least one movable focusing unit 12, from which the laser beam 10 is deflected in the direction of the workpiece 7 and focused for processing. The control, in particular the position control of the laser beam 10 to the workpiece 7 via a software running in a control unit 13, wherein at an external component 14, in particular on a display element 15 in the form of a computer 15 or a control unit, a processing job 16 with a graph 17th and / or a text 18, created and / or loaded, which is transferred to the control unit 13 of the laser plotter 2 via a data link 19, from a stored database 20, a conversion of the transferred data, in particular the processing job 16 with the graph 17 and / or of the text 18, for controlling the individual elements of the laser plotter 2.
    Furthermore, the laser plotter 2 input means 21, in particular direction keys 22 for moving and positioning the focus unit 12 and thus the laser beam 10 on. It is possible that additional additional input keys 21, for example in the form of a confirmation key 23 or the like are present. It is also possible for a display monitor 24 to be present on the processing device 1, on which, for example, the same functions and displays are displayed corresponding to the display element 15. This display monitor 24 can be designed as a touch monitor 24, so that the user can make the control or input by touching or makes this via the input means 21.
    A further detailed description of the mechanical structure of such a laser plotter 2 will not be discussed in more detail, as it is already known from the prior art, in particular from WO 1999/038643 A of the Applicant, and can be taken from this. Of course, a structure of other known from the prior art laser plotter 2 is possible. In order to increase the user-friendliness, it is provided that on the display element 15 or the laser plotter 2 arranged display monitor 24, a work area 25 with a laser position 26 corresponding to the processing area 8 of the laser plotter 2 and the position of the laser beam 10 of the laser 5.6 or the focusing 12, which is made visible by a conventional laser pointer 27 in the processing area 8, is shown.
    According to the invention, it is now provided that the user-friendliness with respect to the focusing of the laser plotter 2 is simplified, in which a so-called semi-automatic adjustment of the focus for the laser or the laser 5, 6 is made, ie the user first has a coarse adjustment, in particular a rough positioning on the laser pointer 27, make what an automatic distance determination to the surface 28 of the workpiece 7 takes place. For this purpose, a distance measuring device 29 is arranged in the region of the focusing unit 12, this being connected to the control unit 13 for transmission of the ascertained data, in particular a height 30 of the inserted workpiece 7. This makes it possible that after inserting the workpiece 7 in the processing area 8, the laser pointer 27 of the laser 5,6 is positioned on or in the region of the workpiece 7, after which activation of the machining process or a focusing process, a distance measurement 31, such schematically indicated in Fig. 2, is performed on the surface 28 of the workpiece 7 and the determined data is passed to the control unit 13, which then calculates a position of the processing table 9 for the optimum focus point of the laser 5,6, taking into account predetermined parameters , in particular the used replaceable laser lens 32, and then the processing table 9 is adjusted.
    In this case, in the laser plotter 2, in particular in the storage unit 13, a corresponding parameter "laser lens or lens 1.5, laser lens or lens 2, laser lens or lens 2.5, laser lens or lens 2,85, laser lens or Lens 3.2, laser lens or lens 4 and laser lens or lens 5 "deposited, so that in conjunction with the determined data from the distance measuring device 29, in particular the height 30 of the workpiece 7, a corresponding position for the processing table 9 is determined and adjusted. The distance measuring device 29 is formed by an ultrasonic sensor which is suitable for the fact that it can detect all materials or material alloys or material mixtures to be processed, in particular glass, aluminum, steel, wood, plastic, substances, or the like, which are also from Laser 5.6 can be processed, that is, that the ultrasonic sensor is tuned to the application of the laser 5.6.
    After a distance measurement 32 has been carried out, the determined data is transferred from the distance measuring device 29 to the control unit 13, which then calculates the corresponding focal point. Once this has been completed, the working table 9 is adjusted accordingly when the machining process is started. In this case, a constant distance measurement 32 is preferably carried out by the distance measuring device 29 during the adjustment of the processing table 9, so that ev. Corrections can still be made. This is advantageous insofar as the processing table 9 is positioned very far away from the distance measuring device 29 and the workpiece 7 has only a very small height 30, so the measurement result is not so exact, since the measuring range is enlarged and inaccurate. However, if subsequently the processing table 9 is moved and approaches the distance measuring device 29, the accuracy is increased. Thus, by means of a constant distance measurement 32, corresponding corrections can still be made during the positioning, so that an optimal adjustment of the processing table 9 is achieved.
    In the illustrated embodiment, to improve the accuracy of the distance measurement 32 is still a correction of the focusing unit 12, in particular the distance measuring unit 29, made, that after activating the machining operation or a focusing operation, the focusing 12 by a definable correction factor in the laser plotter. 2 , stored or stored in particular in the control unit 13, adjusted so that the distance measurement takes place at the position of the laser pointer 27, so that exactly the position is measured, which the user has set via the laser pointer 27, ie Correctionunwert the compensation of the positions of the laser pointer 27 to the distance measuring device 29 corresponds.
    Furthermore, it is also possible for the focusing unit 12 of the laser plotter 2 to be adjusted in accordance with a presettable movement path during the distance measurement 32, ie for the distance measurement 32 to be moved, the focusing unit 12 is moved with the distance measuring device 29 attached thereto, so that a larger range for the distance measurement 32 is covered. Such a procedure can be activated or deactivated by the user in the software running in the control unit 13, so that, for example, this is activated in the case of large workpieces 7 in order to determine the entire work piece 7, in particular the surface 30 of the workpiece 7.
    Moreover, it is possible that due to the determined data from the distance measuring device 29 or from the control unit 13, a position detection of the workpiece 7 is performed, since the use of ultrasound, the most diverse contours of the workpiece 7 are detected and these are subsequently evaluated by the software can, that is, can be determined by the software, as the workpiece 7 has been inserted in the processing area 8, so that the machining process can be aligned accordingly.
    By using ultrasonic sensors, it is also possible that a distance measurement 32 can be performed during the machining process, since the ultrasound has no influence on the laser beam 10. Likewise, the smoke caused by the laser beam 10 in the machining process does not affect the measurement result of the ultra-beam sensor. Especially with large workpieces 7, which have many and preferably large height differences, it is advantageous if the focal point is corrected during operation or the processing table 9 is moved during the process corresponding.
    Of course, it is also possible that a further or a plurality of ultrasonic sensors for distance measurement 32 can be arranged on the focusing unit 12, corresponding correction values being stored for the corresponding ultrasonic sensors. The advantage of such a solution is that the different ultrasonic sensors are used for a wide variety of materials. It is possible that the corresponding material is selected in the software, so that then the corresponding ultrasonic sensor is activated for the measurement or that all ultrasonic sensors measure simultaneously and the best signal or the best data are transmitted.
    For the sake of order, it should finally be pointed out that for a better understanding of the construction of the system 1 and its components or their components, they have been shown partially unevenly and / or enlarged and / or reduced in size.
    Furthermore, individual features or combinations of features from the illustrated and described different embodiments may form separate, inventive or inventive solutions.
    权利要求:
    Claims (12)
    [1]
    claims:
    1. A method for engraving, marking and / or inscribing a workpiece (7) with a laser plotter (2), wherein in a housing (3) of the laser plotter (2) at least one beam sources (4) in the form of a laser (5,6 ) to be machined workpiece (7) is used, wherein the workpiece (7) is deposited on a processing table (9) and a laser beam emitted from the beam source (4) (10) via deflecting elements (11) to at least one focusing unit (12) is deflected by the laser beam (10) in the direction of the workpiece (7) and focused for processing, wherein the control, in particular the position control of the laser beam (10) to the workpiece (7) via a in a control unit (13) running software in that the workpiece (7) is processed line by line by adjusting a carriage, whereby a graphic (17) and / or a text (18) is preferably created on an external component (14), in particular a computer or a control device is, which is transferred to the control unit (13) of the laser plotter (2), which performs a conversion of the transferred data, in particular the graphic (17) and / or the text (18), for controlling the individual elements of the laser plotter (2) characterized in that after inserting the workpiece (7) in the processing area (8), a laser pointer (27) of the laser (5,6) is positioned on or in the region of the workpiece (7), after which activation of the machining process or a focusing process preferably a position correction is performed and then a distance measurement (32) on a surface (28) of the workpiece (7) is performed and the determined data is passed to the control unit (13), which then calculates a position of the processing table ( 9) for the optimum focal point of the laser (5, 6) taking into account predetermined parameters, in particular the used replaceable laser lens (32), and then the processing table (9) is adjusted.
    [2]
    2. The method according to claim 1, characterized in that during the adjustment of the processing table (9) a constant distance measurement (32) is performed.
    [3]
    3. The method according to claim 1 or 2, characterized in that after activating the machining operation or a focusing process, the focusing unit (12) is adjusted by a definable correction factor, so that the distance measurement (32) takes place at the position of the laser pointer (27) ,
    [4]
    4. The method according to one or more of the preceding claims, characterized in that the distance measurement (32) takes place via ultrasound.
    [5]
    5. The method according to one or more of the preceding claims, characterized in that during the distance measurement (32), the focusing unit (12) of the laser plotter (2) is adjusted according to a presettable movement path.
    [6]
    6. The method according to one or more of the preceding claims, characterized in that before the start of the machining process of the machining table (9) and the focusing unit (12), in particular the laser pointer (27), are adjusted to confirm the position.
    [7]
    7. The method according to one or more of the preceding claims, characterized in that based on the determined data, a position detection of the workpiece (7) is performed.
    [8]
    8. The method according to one or more of the preceding claims, characterized in that a plurality of parameters of the machining process with the data of the distance measurement (32) are combined to determine the focus.
    [9]
    9. Laser plotter (2), comprising at least one housing (3) and a display element (15) connected thereto or integrated, in particular a computer, wherein the laser plotter (2) at least one processing area (8) for positioning a workpiece (7), at least one preferably two or more radiation sources (4) in the form of lasers (5, 6) with corresponding deflection elements (11) and a preferably movable focusing unit (12) and a control unit (13) for controlling the individual elements, and the control unit (13 ) for receiving data generated on an external component, in particular on the display element (15), in particular a graphic (17) or text (18), characterized in that in the region of the focusing unit (12) a distance measuring device (29 ), and these for transmitting the determined data, in particular the height (30) or distance of the inserted workpiece (7), connected to the control unit (13) is.
    [10]
    10. laser plotter (2) according to claim 9, characterized in that the distance measuring device (29) is formed by an ultrasonic sensor.
    [11]
    11. Laser plotter (2) according to claim 9 or 10, characterized in that in the laser plotter (2), in particular in the control unit (13), a position correction value for the distance measuring device (29) is stored.
    [12]
    12. Laser plotter (2) according to one or more of the preceding claims 9 to 11, characterized in that a plurality of distance measuring devices (29), in particular ultrasonic sensors, are positioned on the focussing unit (12).
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50402/2015A|AT517185B1|2015-05-13|2015-05-13|Method for engraving, marking and / or inscribing a workpiecewith a|ATA50402/2015A| AT517185B1|2015-05-13|2015-05-13|Method for engraving, marking and / or inscribing a workpiecewith a|
    PCT/AT2016/050132| WO2016179621A1|2015-05-13|2016-05-09|Method for engraving, marking and/or inscribing a workpiece using a laser plotter, and laser plotter herefor|
    ES16728590T| ES2789498T3|2015-05-13|2016-05-09|Method of engraving, marking and / or inscribing a workpiece with a laser scriber and laser scriber for it|
    EP16728590.7A| EP3294486B1|2015-05-13|2016-05-09|Method for engraving, marking and/or inscribing a workpiece using a laser plotter, and laser plotter herefor|
    PL16728590T| PL3294486T3|2015-05-13|2016-05-09|Method for engraving, marking and/or inscribing a workpiece using a laser plotter, and laser plotter herefor|
    CN201680027758.1A| CN108076633B|2015-05-13|2016-05-09|Method for engraving, marking and/or inscription of workpieces with a laser plotter and laser plotter for use in the method|
    US15/573,016| US10898973B2|2015-05-13|2016-05-09|Method and system for engraving, marking and labelling a workpiece using a laser plotter|
    TW105114714A| TWI671158B|2015-05-13|2016-05-12|A method for engraving, marking and/or inscribing a workpiece with a laser plotter and laser plotter for this|
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